For the first time, two students from Swinburne University of Technology have been awarded the prestigious New Colombo Plan (NCP) Scholarship in the same year.
The NCP initiative provides undergraduate students the opportunity to undertake study and an internship on a 12 month paid scholarship in the Asia-Pacific region.
This year, Swinburne students Samuel Williams and Arman Haque won the opportunity to study overseas.
Mr Williams, a Bachelor of Engineering (Civil) (Honours)/Bachelor of Business student will be studying at City University Hong Kong, where he hopes to meet and network with likeminded students.
“The City University of Hong Kong appealed to me as it is one of the premier engineering institutions in the Indo-Pacific region,” says Mr Williams.
“I will build lasting relationships, both personal and professional, develop my cultural literacy skills and expand my knowledge of civil engineering.”
Mr Haque is a Bachelor of Design student and will be travelling to China to attend Shanghai University.
Both Mr Williams and Mr Haque join an esteemed list of Swinburne students that have previously won New Colombo Plan Scholarships, including Denver Linklater, Daniel Eastwood-Whitaker and 2015 winner Austin Wyatt.
The New Colombo Plan encourages a two-way flow of students within the region, complementing the thousands of students from the region coming to Australia to study each year.